Monthly Archives: February 2018

NAMICS dam and fill encapsulants continue to protect sensitive packages

Dam and fill materials encapsulate your wire bonded device with an electrically insulating material. Dam and fill is a two-part process consisting of a high viscosity dam material being dispensed first, followed by dispensing lower viscosity fill material in the well made by the dam material. These products offer excellent moisture protection, very low stress, […]

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NAMICS Corporation develops improved sintered silver adhesive

NAMICS Corporation has developed a sintered silver die attach paste (UNIMEC H9890-6A) for the semiconductor market. UNIMEC H9890-6A is a low-temperature sintered die attach paste using the Metallo-Organic (MO) technology. This high thermal conductive paste does not require pressure while curing, and the porous sintered structure has been reinforced by a proprietary resin system. This […]

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NAMICS Corporation develops improved dam-and-fill encapsulants.

NAMICS Corporation has developed an epoxy dam material (CHIPCOAT G8345D) and an accompanying epoxy fill material (CHIPCOAT G8345-6) for the semiconductor market. Dam-and-Fill materials encapsulate your wire bonded device as an electrically insulating material. Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP and BGA. CHIPCOAT […]

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New safeguards to prevent the use of counterfeit NAMICS Products

December 27, 2017: Recently, we determined that counterfeit products with the NAMICS logo have been sold illegally in some overseas countries. The NAMICS logo and trademarks are used on the counterfeit products without our permission. However, it is difficult to determine from their appearance whether the products are genuine NAMICS products or counterfeit. Therefore, to […]

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