CuTAP

CuTAP is a newly developed copper surface treatment technology for copper foil. The CuTAP improves the surface profile and creates the ability for fine-line patterning and lower dB on high-frequency application by reducing skin effect. In addition, adhesion strength is increased to typical dielectric substrates.

  • High-density interconnects for fine line PWB
    • Improves interface between Cu foil & dielectric smooth
    • Etching using conventional process enables smaller features
    • Higher adhesion between Cu foil and dielectric
  • High-speed devices (servers, data centers)
    • Better interface between Cu foil & dielectric without transmission loss
    • Increased adhesion between Cu foil and dielectric
  • Lithium-ion Battery
    • Increases adhesion between current collector (Cu foil) and anode