Next Generation Stretchable Materials
NAMICS latest generation of stretchable materials for interconnects, heating and bonding on flexible substrates offer stable performance over repeated elongation with outstanding durable and designed for high volume manufacturing making implementation easy and economical. NAMICS diverse product line includes:
XE181 Series, silver-based conductive, is designed for printing interconnects of low-voltage circuitry on elastic film and textile with low resistivity, approximately 2 x 10-5 Ω-cm, and high stretch-ability. The XE181 series is compatible with a wide variety of substrates and can be printed down to 50 um line widths and spacing.
XE182 Series, carbon-based conductive, allows for printing interconnects or a PTC (positive temperature coefficient) function in a low power heater offering uniform heating, thin thickness and flexible design. It also provides high stretchability and high reliability due to excellent moisture resistance for a robust solution.
XE184 Series, stretchable conductive adhesive, is used to bond components, such as sensors and connectors, to flexible substrates with high flexibility due to low elastic modulus, ability to cure as low as 80⁰C and formulated to be easily dispense for ease of manufacturing.
XE185 Series, dielectric-based material, is designed to protect conductive circuits, especially on wearable applications, while maintaining high stretchability with conductive past and dramatically improves the wash resistance of the overall circuitry.
These innovative materials provide designers and engineers the freedom to develop the next generation of smart fabrics, advanced flexible hybrid electronics (FHE) or in-mold electronics with unmatched reliability and cutting-edge technology.