ADFLEMA (Advance Flexible Materials) films are insulating, thermally cured adhesive films for high-frequency applications requiring low dielectric constants (Dk) and low dielectric loss tangent (Df) enabling high-speed processing and low transmission loss. NAMICS materials feature:
- Low dielectric constant and tangents similar to Teflon.
- Ability to create thinner, more flexible substrates. Ideal for flexible printed circuits (FPC)!
- Excellent melt flow to fill fine copper pitch designs.
- Ease of manufacturing with low temperature and pressure processing and excellent via formation through laser drilling.