NAMICS High Thermal Insulating ADFLEMA Film offers low thermal resistance with thin thickness and high thermal conductivity suitable for power module and heat sink applications. Our lineup of insulating adhesive films includes the least 50 um thickness. Also, it has the thermal conductivity as 3 W/mK. Currently, we are progressing to develop the additional higher thermal conductivity as over 10W/mK.
- Low thermal resistance and film thickness to reduce package size
- High breakdown voltage for outstanding insulation stability
- Uniform coverage for improved reliability and performance
- High reliability due to low modulus and excellent peel strength on copper