Does your BGA or CSP need a underfill with reworkablity and reliability? Come visit us at booth #213 at the IMAPS 2018 in Pasadena this week to learn about our latest generation of reworkable underfills. These materials protect temperature sensitive components because they offer high flow rate at room temperature and low temperature cure (as low as 80C).
Flow at room temperature
NAMICS reworkable underfill offer unmatched reliability due to precisely control of filler content and state of the art resin system. End result is the perfect balance of reliability and reworkability. These underfills offer outstanding performance in thermal cycling and thermal shock, drop test and other demanding requirements for the most challenging applications.
For more information on the conference and expo, visit https://ims2018.org/
#reworkable #underfill #epoxy #microelectronicpackaging #BGA #CSP
Dam and fill materials encapsulate your wire bonded device with an electrically insulating material. Dam and fill is a two-part process consisting of a high viscosity dam material being dispensed first, followed by dispensing lower viscosity fill material in the well made by the dam material. These products offer excellent moisture protection, very low stress, and high Tg to meet high reliability application
For over twenty years dam and fill encapsulants have protected fragile integrated circuits (IC) and wire bonds. In 1995 NAMICS Corporation developed and commercialized their first dam and fill, G8345D and G8345-6 respectively. At that time, IC’s did not have the high I/O wire bonds that today’s IC’s have. These products perfumed admirably for ten years but with package miniaturization wire bond pitch tightened.
In early 2006 NAMICS Corporation responded to its customers’ needs and developed G8345D-37 and G8345-29. These products have a much smaller mean and maximum particle sizes in order to flow in between the wire bonds. Due to the European Union’s REACH raw material demands, in 2016 NAMICS developed G8345D-46 and G8345-146. These products have the same fine fillers present in G8345D-37 and G8345-29 but they do not contain raw materials on the Substances of Very High Concern (SVHC) list. G8345D-46 and G8345- 146 can be used in the European Union or anywhere there is concern about SVHC materials.
NAMICS Corporation is a technology and development company. NAMICS modifies existing products and develops new products based on the customers’ needs. For over twenty years NAMICS has been committed to the dam and fill market, developing new products as needed. Product development continues as new and exciting dam and fills are being developed.
If you want to know more about NAMICS dam and fills please visit CHIPCOAT dam and fills. If you want more information, such as data sheets, please call Marie Roy at (978) 499-0900 or email her at email@example.com. Marie will fulfill your request and direct you to the best person to assist you
G8345D & G8345-6 (Dam & Fill)
NAMICS Corporation has developed an epoxy dam material (CHIPCOAT G8345D) and an accompanying epoxy fill material (CHIPCOAT G8345-6) for the semiconductor market. Dam-and-Fill materials encapsulate your wire bonded device as an electrically insulating material. Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP and BGA. CHIPCOAT G8345D and G8345-6 are fast curing, low CTE (low stress), offer high package reliability and reduced warpage.
CHIPCOAT G8345D and G8345-6 are in full production and are available for sampling. Standard packaging is frozen syringes with 50 grams in a 30cc syringe; larger cartridges are available. To find out more about these NAMICS Dam-and-Fill materials, please visit this link or contact your local NAMICS sales representative.