Category Archives: tradeshow

NAMICS latest generation of reworkable underfill

Does your BGA or CSP need a underfill with reworkablity and reliability?  Come visit us at booth #213 at the IMAPS 2018 in Pasadena this week to learn about our latest generation of reworkable underfills.  These materials protect temperature sensitive components because they offer high flow rate at room temperature and low temperature cure (as low as 80C).

Flow at room temperature

NAMICS reworkable underfill offer unmatched reliability due to precisely control of filler content and state of the art resin system.  End result is the perfect balance of reliability and reworkability.  These underfills offer outstanding performance in thermal cycling and thermal shock, drop test and other demanding requirements for the most challenging applications.

For more information on the conference and expo, visit

#reworkable #underfill #epoxy #microelectronicpackaging #BGA #CSP

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NAMICS to exhibit at IMAPS 2018

Stop by NAMICS Corporation booth #213 at the upcoming IMAPS 2018 in Pasadena on October 9th thru October 10th.  Learn about:

  • Latest generation of underfills including high reliability, reworkable underfills and high thermal conductive underfill
  • High performance TIM for high power flip chip packaging
  • Sprayable EMI shielding materials
  • Pressure-less, low temperature sintering technology
  • Stretchable materials for wearable and flexible hybrid electronics (FHE)

Stop by to learn how NAMICS can provide a solution for microelectronic packaging needs. #underfill #dieattach #microelectronicspackaging #staycool #reworkable #wearable #fhe #imaps

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