NAMICS to exhibit at IMAPS 2018

Stop by NAMICS Corporation booth #213 at the upcoming IMAPS 2018 in Pasadena on October 9th thru October 10th.  Learn about:

  • Latest generation of underfills including high reliability, reworkable underfills and high thermal conductive underfill
  • High performance TIM for high power flip chip packaging
  • Sprayable EMI shielding materials
  • Pressure-less, low temperature sintering technology
  • Stretchable materials for wearable and flexible hybrid electronics (FHE)

Stop by to learn how NAMICS can provide a solution for microelectronic packaging needs. #underfill #dieattach #microelectronicspackaging #staycool #reworkable #wearable #fhe #imaps