corner bond

NAMICS’ Corner Bond provides an alternative to complete underfill process. The material is dispensed to all four corners of the CSP/BGA to reinforce component and improve reliability. Corner bonded provides a simplified manufacturing process for CSP/BGA, eliminating the capillary flow time and providing more reliability than unreinforced bumps.

Features of corner bond materials are:

  • Simplified process with no capillary underfill flow process
  • Low dispensing volume for an economical solution to BGA/CSP reinforcement
  • High throughput with fast cure system
  • No void issue

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