dam and fill encapsulants

NAMICS’ Dam and Fill materials encapsulate your wire-bonded device as an electrically insulating material. The dam material is high-aspect-ratio material—dispensed first around the perimeter of the component, followed by fill-in the center to cover the component. NAMICS’ leading materials offer excellent moisture protection, very low stress, and high Tg to meet high-reliability application requirements.

Additional features include:

  • Fine filler system for fine pitch wirebond applications.
  • SVHC (Substances of Very High Concern) version to meet stringent EU requirements
  • Ability to be jet-dispensed for optimal control
  • Fast curing for high throughput
  • High ionic purity and low outgassing for sensitive semiconductor devices