NAMICS Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level, offering high reliability and minimal warpage after curing.
- Suitable for reflow and grinding after PMC process.
Narrow Gap Flow
- Suitable for low profile packages.
- NAMNICS’ LCM allows higher productivity than current LCM thanks to its faster curing speed, resulting in increased UPH (Units Per Hour) at molding process.