liquid molding compounds

NAMICS Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level, offering high reliability and minimal warpage after curing.

Low warpage

  • Suitable for reflow and grinding after PMC process.

Narrow Gap Flow

  • Suitable for low profile packages.

High productivity

  • NAMNICS’ LCM allows higher productivity than current LCM thanks to its faster curing speed, resulting in increased UPH (Units Per Hour) at molding process.