pre-applied materials (PAM)

For extremely narrow-pitch applications, NAMICS offers a pre-applied underfill paste with fast curing adhesive designed for Thermal Compression Bonding (TCB) of very fine pitch Cu Pillar Flip Chip devices. NAMICS’ pre-applied underfill offers the benefit of a reduced package footprint by minimizing fillet and fluxing and mass reflow process.

Features include:

  • Designed for high volume manufacturing with fast TCB cure times (less than 5 seconds)
  • Optimize key properties for high reliability