wafer level coating (WBC) die attach

An alternative to traditional die attach, NAMICS Wafer Level Coating (WBC) Die Attach adhesives are designed to meet latest requirements of smaller die and footprints by applying the adhesive directly to the backside of the wafer by screen printing process and b-staged. The product delivers a process with high UPH, outstanding control of BLT (bondline thickness), no die tilt, and minimal fillet for maximization of the chip footprint.


  • Improve production speed (UPH)
  • Excellent printability results:
    • Excellent bond line thickness control
    • No die tilt
    • Minimal fillet to reduce footprint
  • Long shelf life after B-Stage for improved operating window