Protect your connections
NAMICS is proud to be the world’s biggest supplier of underfills—insulating materials used in the flip-chip microchip mounting process. Underfill flows into and fills the gaps between chips and the surfaces to which they are mounted by conductive connections (“bumps”).
Cover all your gaps
NAMICS formulates a diverse line of underfills, each specially synthesized for the demands of today’s advanced packaging technologies: underfills for use with lead-free solder and copper-pillar (Cu pillar) bumps; high-thermal-conductive underfills; pressure-cure-oven and vacuum-assisted capillary underfills for stacked (3D) packaging; and ultra-fine-filler underfills with outstanding flow properties for jet dispensing into very narrow gaps.
Avoid the voids
Boasting outstanding rheology and unrivaled resistance to warpage, our underfills prevent the birth of bubbles (“voids”) and provide excellent stress protection to deliver the highest reliability, even in the most demanding applications.