Tag Archives: liquid sealants

NAMICS Corporation develops improved dam-and-fill encapsulants.

NAMICS Corporation has developed an epoxy dam material (CHIPCOAT G8345D) and an accompanying epoxy fill material (CHIPCOAT G8345-6) for the semiconductor market. Dam-and-Fill materials encapsulate your wire bonded device as an electrically insulating material. Dispensing a high-viscosity dam followed by a low-viscosity fill, will create a completed encapsulated package for your CSP and BGA. CHIPCOAT […]

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