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NAMICS Corporation develops improved sintered silver adhesive

NAMICS Corporation has developed a sintered silver die attach paste (UNIMEC H9890-6A) for the semiconductor market. UNIMEC H9890-6A is a low-temperature sintered die attach paste using the Metallo-Organic (MO) technology. This high thermal conductive paste does not require pressure while curing, and the porous sintered structure has been reinforced by a proprietary resin system. This […]

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