The subject of printed electronics has received increasing attention in recent years as a promising technology for the next generation of IoT. Compared with photolithography, it not only enables circuit fabrication on flexible substrates, but also cost reduction through the elimination of some processes such as exposure and etching.
Conductive paste is a key material for this technology. Currently silver is the most commonly used filler for conductive pastes due to its high conductivity and stability. However, silver has some concerns such as price volatility and ionic migration. Therefore, copper is expected to be an acceptable alternative material because of its significant advantage in cost and higher resistance to migration while providing the same level of conductivity as silver. LEARN MORE