In recent years, forming flexible electronic circuits on plastic substrates, including PET, has been studied due to demands for weight reduction and miniaturization of electronic devices. We are currently developing silver pastes with a volume resistivity of 1.0E-06 (Ω·cm) cured at a 150℃, and we will be rolling them out in applications in the future.
As the high function of the electronic device advances, conductive paste which has low-temperature cure, low resistance and high thermal conductivity are required. NAMICS own MO technology enables to sinter Ag at low temperature 150 degree and also get low resistance and high thermal conductivity. This MO technology can meet customer’s various requirements. LEARN MORE